International Perspective · August 15, 2026
① Cisco Reports Record Q4 FY2026: Revenue $17.3B (+18% YoY), Hyperscaler AI Orders Hit $4B in Quarter — Cisco reported Q4 FY2026 (ended Jul 25, 2026) revenue of $17.3B, +18% YoY, with full-year revenue of $63.3B (+12%). Hyperscaler AI infrastructure orders reached $4B in Q4, bringing FY2026 AI orders to $9.3B; the company delivered ~$4B AI revenue in FY2026 and expects ~$7.5B in FY2027. Networking product revenue grew +28% in Q4. Cisco guided FY2027 revenue of $72.2B-$73.4B and raised AI expectations, with CEO Chuck Robbins citing a 'networking supercycle' underway. (Cisco IR / Newsroom)
② SanDisk Unveils Multiyear NAND Roadmap and FY2028-30 Model at Investor Day: ~80% Gross Margin, HBF Momentum — At its Aug 13, 2026 Investor Day ('Sandisk In Focus'), SanDisk outlined a multiyear NAND roadmap and a sustainable long-term financial model for FY2028-FY2030: revenue growth mid-to-high teens, non-GAAP gross margin ~80%, operating margin ~75%, adjusted FCF margin ~50%, returning 100% of excess cash to shareholders. It unveiled BiCS9 QLC (BiCS8 array + BiCS10 CMOS) for AI workloads and BiCS10 QLC with 60% higher bit density vs BiCS8; projects AI data center flash TAM of 1.2 zettabytes by 2030. HBF (High Bandwidth Flash) technology is gaining momentum with an ecosystem forming alongside SK hynix. (SanDisk IR / Business Wire)
③ SK hynix at FMS 2026: 16-High HBM4, First Wafer-Bonded 375-Layer NAND, PS1101 QLC eSSD — At FMS 2026 (Aug 4-6, Santa Clara), SK hynix showcased 16-high 48GB HBM4 and HBM4E, its first wafer-bonded 375-layer 4D NAND (V10), the PS1101 QLC enterprise SSD, and CMM-Ax memory expansion. The company pitched a tiered memory architecture for AI, with HBM4 and advanced NAND targeting 2027 volume production; it also advanced HBF (High Bandwidth Flash) standardization jointly with SanDisk. (SK hynix Newsroom)